Moo Young Lee, Jeong Woo Koo, Jun Ho Jang, Young In Jo, Jia Bin Yeo, Jeong Eun Kim, Jung Sug Hong, Jeong Hyun Kim, Seungwoo Choi, Ki Tae Nam
ACS Sustainable Chem. Eng. 13, 7, 2845–2852 (2025).
Daily Archives: July 29, 2025
Improved Diffusion Barrier by Stuffing the Grain Boundaries of TiN with a Thin Al Interlayer for Cu Metallization
Ki Tae Nam, Arindom Datta, Soo-Hyun Kim, Ki-Bum Kim Applied Physics Letter 79, 2549 (2001).